In a groundbreaking experiment, researchers from Tsinghua University have proven that two-dimensional (2D) semiconductor materials can withstand the harsh conditions of space.

Physicists have developed a novel approach to maintain special quantum characteristics, even in 3D materials, with potential applications in optical systems and advanced computing.

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract ...

Working with a new computational model, researchers uncovered an algorithm that reveals how the primate brain constructs internal three-dimensional (3D) representations of an object when viewing a two ...

Researchers have developed a technique that allows artificial intelligence (AI) programs to better map three-dimensional spaces using two-dimensional images captured by multiple cameras. Because ...