A new technical paper titled “Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application” ...
Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.
AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...
Keysight’s Richard Duvall highlights the need for rigorous simulation and validation to overcome challenges such as signal ...
Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...
Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of Bologna)
Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.
A new technical paper titled “Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors” was published by researchers at Rochester Institute of Technology and Corning Research ...
Trusting which data to use and what can be deleted still requires human oversight; startups are at a disadvantage.
Structured Mixed Precision for Efficient Deep Learning Hardware Codesign” was published by Intel. Abstract “In this paper, we ...
Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for ...
A chiplet supermarket is still years off, but progress is being made on all fronts.
A new technical paper titled “Sensitivity and contrast of indium nitrate hydrate resist evaluated by low-energy electron beam ...
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